01
SMT / THT
High-speed pick-and-place, fine-pitch and BGA work, nitrogen reflow, selective solder, and wave solder for mixed-technology boards.
Manufacturing
The plant is organized around process cells that can be booked independently or as a full turnkey EMS program.
Process map
Six process cells, bookable independently or as one turnkey program.
High-speed pick-and-place, fine-pitch and BGA work, nitrogen reflow, selective solder, and wave solder for mixed-technology boards.
Single- and double-sided assemblies, conformal coat, underfill, press-fit, and secondary operations after inspection.
AOI, X-ray on request, ICT, flying probe, functional test, firmware programming, and reliability screens.
Rack and chassis integration, cable assemblies, mechanical sub-assemblies, labeling, and retail or bulk pack.
Board-to-system builds for compute, storage, and network hardware used in enterprise and data-center programs.
Component sourcing, bonded inventory, incoming QC, kitting, and outbound fulfillment across the United States.
Typical programs
| Segment | Examples | Plant focus |
|---|---|---|
| Cloud & networking | Servers, switches, storage controllers | System integration and test |
| Computing | Boards, power, industrial PCs | SMT density and ICT coverage |
| Industrial / IoT | Controllers, gateways, sensors | Mixed technology and conformal coat |
| Consumer electronics | Connected devices and accessories | High-volume SMT and pack-out |
Engineering
New products move through a gated launch: documentation freeze, stencil and fixture design, first-article inspection, process capability, and a written ramp plan.
Next step
Include annual volume, board class, and whether the build is consigned or turnkey.